第一层次（Levell或FirstLevel）：该层次又称为模块层次的封装（Chip Level Packaging），是指把模块电路与封装基板或引脚架（Lead Frame）之间的 粘贴固定、电路连接与封装保护工艺，使之成为易于取放输送，并可与下一...
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Wafer Level Chip Size Packaging 晶圆级芯片尺寸封装 ; 级芯片尺寸封装
Wafer Level Chip Scale Packaging 晶圆片级芯片规模封装 ; 芯片尺寸封装
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
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