die chip 崩片
die attach or chip bonding 芯片贴装
stacked die chip 叠层芯片
Chip or Die 晶片
die or chip 应用的范围着重于晶圆裸晶
stacked-die chip scale package 叠层芯片尺寸封装
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线,说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
More important than the CPU cores, however, is the fact that half the chip die is now taken up by the graphics-processing circuitry.
然而,比CPU核心,更重要的是一半的芯片模具现在采取的图形处理电路。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线,说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
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