...刊网 免费论文下载 关键词: 超薄圆片 崩片 背崩 正面崩片 崩裂 划片刀过载[gap=1072]Key words: ultrathin wafer; die chip; backside chip; topside chip; die chip and crack; blade overloading ..
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stacked die chip 叠层芯片
stacked-die chip scale package 叠层芯片尺寸封装
Chip Die 缺角
die attach or chip bonding 芯片贴装
die or chip 应用的范围着重于晶圆裸晶
Chip or Die 晶片
More important than the CPU cores, however, is the fact that half the chip die is now taken up by the graphics-processing circuitry.
然而,比CPU核心,更重要的是一半的芯片模具现在采取的图形处理电路。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅;
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
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