根据本发明，不含树脂的焊膏由一种金属粉末，特别是软焊料 和一种凝胶体制成，其中，根据本发明的凝胶体在重熔金属粉末的过 程中，不在金属表面上留下残留物。

The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.

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