研磨带是一种带状的研磨产品，是用静电植砂或者涂覆的方式，将磨料均匀的涂覆在聚酯薄膜带基上，可根据下游不同的用途裁剪成不同的尺寸。按照生产方式的不同可以分为精密研磨带和精密抛光带两大类。
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
利用紫外光辐照c4研磨带以变为无粘合性，并且随后将其去除。
The C4 grind tape is irradiated by ultraviolet light to become less adhesive, and is subsequently removed.
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