在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
利用紫外光辐照c4研磨带以变为无粘合性，并且随后将其去除。
The C4 grind tape is irradiated by ultraviolet light to become less adhesive, and is subsequently removed.
罗礼士有一台特制的砂带研磨机，上面设定是：弱→强→刮胡。
Chuck Norris owns a custom belt sander with three settings: Low, High, and Shave.
本文从砂带，研磨方法，试样表面状况三个方面，分析了试样研磨对铜合金主要元素测试结果的影响。
This paper analyses that grinding of sample influence testing result of main element in copper alloy from three respect, emery cloth, grinding method, surface condition of sample.
一种带一体式集尘系统的研磨制品安装组件。
The invention provides an abrasive article mounting assembly with an integral dust collection system.
一种带一体式集尘系统的研磨制品安装组件。
The invention provides an abrasive article mounting assembly with an integral dust collection system.
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