晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。

Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

youdao

摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。

Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

youdao

摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。

Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

youdao