喷锡板一般为多层（4-46层）高精密度PCB样板，已被国内多家大型通讯、计算机、医疗设备及航空航天企业和研究单位都可以用到。
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。
Tin spray applied to circuit boards, hot air leveling and wave soldering, welding and hot dip tin lead anyone.
适合线路板制程，低泡沫高活性，YA6001适合垂直喷锡，YA6002适合水平喷锡。
Suitable for circuit board manufacturing processes, low foam and high activity; vertical solder spray for YA6001 and horizontal solder spray for YA6002.
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