将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。
Tin spray applied to circuit boards, hot air leveling and wave soldering, welding and hot dip tin lead anyone.
适合线路板制程，低泡沫高活性，YA6001适合垂直喷锡，YA6002适合水平喷锡。
Suitable for circuit board manufacturing processes, low foam and high activity; vertical solder spray for YA6001 and horizontal solder spray for YA6002.
粘性佳，耐高温、耐溶剂、保持力强、不残胶。；用于印刷线路板(PCB)过锡炉喷锡和波峰焊过程中遮蔽保护金手指。
Good performance in adhesion, High Temperature Resistance, Solvent Resistance, Strong Holding Force, No Residual Adhesive Left. For protecting gold finger in the process of PCB.
此外，第二期厂房设备亦可处理喷锡抗氧化涂布沉金全板镀金沉锡及沉银等表面处理工序。
It is also equipped with tin spraying, anti - oxidizing coating, and gold, tin and silver emulsion processing capabilities. construction works are expected to complete in 12 months.
此外，第二期厂房设备亦可处理喷锡抗氧化涂布沉金全板镀金沉锡及沉银等表面处理工序。
It is also equipped with tin spraying, anti - oxidizing coating, and gold, tin and silver emulsion processing capabilities. construction works are expected to complete in 12 months.
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