在世界半导体集成电路芯片生产领域，美日两国竞争激烈。
In the area of world semiconductor industry there has been a fierce competition between the United States and Japan.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
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