在世界半导体集成电路芯片生产领域，美日两国竞争激烈。
In the area of world semiconductor industry there has been a fierce competition between the United States and Japan.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
本文首次利用时域有限差分(FDTD)法分析了高速集成电路芯片内半导体基片上的有耗互连传输线的电特性。
A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.
深亚微米和纳米级的半导体技术迅速进步，使得集成电路的设计已经进入系统集成芯片时代。
The rapid progress of semi-conductor technology on deep sub-micro and nanometer scale announces the SOC era of IC design.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。
The effects of choosing lapping bevel Angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
一种自供电低功耗集成电路芯片，其特征在于，该芯片包括一个半导体衬底以及在该衬底上的低功耗集成电路和太阳能电池；
The invention belongs to the technical field of integrated circuits, in particular to a self-powered low power consumption integrated circuit chip and a preparation method thereof.
公司自主研发生产半导体系统集成电路芯片及模块的产品，产品含括先进无线通信，蓝牙，摄像头，全球定位系统，移动电视，并提供完整配套的产品售后应用服务。
AzureWave self designed and produced the world smallest SiP IC, mini module CARDS which aims to the main stream market in Wireless communication, Bluetooth, Camera module, GPS, DVB and so on.
公司自主研发生产半导体系统集成电路芯片及模块的产品，产品含括先进无线通信，蓝牙，摄像头，全球定位系统，移动电视，并提供完整配套的产品售后应用服务。
AzureWave self designed and produced the world smallest SiP IC, mini module CARDS which aims to the main stream market in Wireless communication, Bluetooth, Camera module, GPS, DVB and so on.
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