半导体生产流程由晶圆制造、晶圆测试、芯片封装和封装后测试组成。半导体封装测试是指将通过测试的晶圆按照产品型号及功能需求加工得到独立芯片的过程。
-设备进行日常保养和维护-半导体封装测试(assembly & test)装备维护-需倒班工作岗位要求:- 学历:大专-会韩语者优先-专业:理工科工作地点:重庆西永保税区b区
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文章将阐述半导体封装测试厂如何选用并有效实施CONWIP系统,以及它在生产控制、降低库存和缩短生产周期上发挥的积极作用。
This often leads to excessive or unbalanced WIP on production line and eventually impacts the output and manufacturing cost. This paper illustrates how CONWIP systems was adopted …
安靠率先通过外包半导体封装和测试服务方式使这些幻想变成现实。
Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services.
致力成为一家综合的半导体测试解决方案供应商,是Electroglas重要的战略目标之一,因此伊智也为器件封装提供后道测试机械手和测试台管理软件。
They now also offer a final test handler for packaged devices and test floor management software as part of their strategy to be a comprehensive semiconductor test solutions provider.
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