For analyzing the thickness of the electroplating layer, the product qualities would be increased.
分析影响板面镀层厚度均匀的因素,达到提高产品质量。
Recommended substrate: harden PC, harden PMMA, the surface of UV coating, electroplating layer, stainless steel, stone, marble, glass, etc.
适用基材:加硬pc,加硬pmma, UV漆面,电镀面,不锈钢,石头,大理石,玻璃等。
Because the composite electroplating layer containing diamond grains must be distributed on the hole surface of die, it brings some difficulties to the process.
由于含有金刚石颗粒的复合镀层要镀在胎具的内孔孔壁上,所以给电镀工艺带来一定的困难。
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