Because the composite electroplating layer containing diamond grains must be distributed on the hole surface of die, it brings some difficulties to the process.
由于含有金刚石颗粒的复合镀层要镀在胎具的内孔孔壁上，所以给电镀工艺带来一定的困难。
Recommended substrate: harden PC, harden PMMA, the surface of UV coating, electroplating layer, stainless steel, stone, marble, glass, etc.
适用基材：加硬pc，加硬pmma,UV漆面，电镀面，不锈钢，石头，大理石，玻璃等。
Recommended substrate: harden PC, harden PMMA, the surface of UV coating, electroplating layer, stainless steel, stone, marble, glass, etc.
适用基材：加硬pc，加硬pmma,UV漆面，电镀面，不锈钢，石头，大理石，玻璃等。
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