... 富士软件公司 fsi; fuji software inc 电子元件包膜 electronic package 电子元件会议 electronic components conference ...
基于4个网页-相关网页
standard electronic package 标准电子组件 ; 标准电子仪器组件 ; 规范电子组件
Electronic package and assembly 电子封装组装
SEP standard electronic package 标准电子组件
sestandard electronic package 标准电子组件
3D electronic package 三维电子封装
d electronic package 三维电子封装
electronic package shell 电子封装壳体
micro-electronic package 微电子封装
So FEM numerical simulation technique is feasible and effectual in the electronic package design. The results are expected to act as database for improving reliability of package and optimized design.
在电子封装中采用有限元数值模拟技术是可行的、高效的,计算结果为提高封装器件的可靠性和封装器件的优化设计提供了理论依据。
参考来源 - 电子封装中热可靠性的有限元分析However, the reliability of the solder joint is one of the key factors during the development of MCM. The problems about the reliability of the solder joint are important and urging to solve in the electronic package.
焊点的可靠性问题是电子封装技术领域亟待解决的重要课题,是决定电子产品质量与发展的基本问题。
参考来源 - 多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测·2,447,543篇论文数据，部分数据来源于NoteExpress
To meet the needs of the electronic package materials, the thermal properties of the composites were analyzed.
适应电子封装选材的应用背景，对复合材料进行了热学性能分析。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.
因此，对微电子封装器件的温度分布以及热应力进行研究就显得十分重要，具有重要的理论和实际意义。
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