It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
How many of us in the parallel vast universe are there? How many times live and die? How many silent reincarnations?
在这浩瀚的宇宙之中，有多少个平行的我们？有多少场生死覆灭？又有多少静默的轮回？
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
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