It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
The utility model solves the problem of the existing die cutter needing the bedding under the stamping-out object to keep the cutting plane of the cutter parallel with the stamping-out plane.
本实用新型解决了现有模切机需在被冲压物下面进行铺垫才能使刀具切割平面与被冲压面平行的问题。
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