It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
The utility model solves the problem of the existing die cutter needing the bedding under the stamping-out object to keep the cutting plane of the cutter parallel with the stamping-out plane.
本实用新型解决了现有模切机需在被冲压物下面进行铺垫才能使刀具切割平面与被冲压面平行的问题。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
This paper discusses the principle of combination cam curves and its application in the paper feeder of die-cutting machine. It introduces the fundamentals of a parallel indexing cam design software.
本文通过拼接运动规律在平压模切机输纸机构中的应用原理的论述，介绍了一种平行分度凸轮机构设计软件的原理。
By establishing the mathematical model of motion curve combination, this paper discusses the combination methods of parallel-indexing-cam curves in paper-feeding mechanism of die-cutting machine.
通过建立拼接运动规律的数学模型，论述了模切机输纸机构中平行分度凸轮运动规律的拼接方法。
By establishing the mathematical model of motion curve combination, this paper discusses the combination methods of parallel-indexing-cam curves in paper-feeding mechanism of die-cutting machine.
通过建立拼接运动规律的数学模型，论述了模切机输纸机构中平行分度凸轮运动规律的拼接方法。
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