The results show that the cladding layer has compact and flawless microstructure and has been metallurgically integrated with pure copper substrate.
结果表明：所制得熔覆层组织致密、无裂纹，与基体形成了良好的冶金结合。
The temperature for tungsten coating on copper substrate is higher than that on molybdenum.
当其它条件都相同时，在铜基体上获得钨镀层比钼基体上所需的温度略高一些；
Results showed that adhesion between film and copper substrate could be greatly improved using such interlayers.
采用钛铝-钼过渡层，金刚石膜和铜衬底间的结合力大大提高。
应用推荐