The temperature for tungsten coating on copper substrate is higher than that on molybdenum.
当其它条件都相同时，在铜基体上获得钨镀层比钼基体上所需的温度略高一些；
Results showed that adhesion between film and copper substrate could be greatly improved using such interlayers.
采用钛铝-钼过渡层，金刚石膜和铜衬底间的结合力大大提高。
At the same time the size of the copper substrate and the cooling condition of substrate's bottom are optimized.
并对铜基板尺寸、基板底面散热条件等几项关键参数进行了优化设计。
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