The results show that the cladding layer has compact and flawless microstructure and has been metallurgically integrated with pure copper substrate.
结果表明：所制得熔覆层组织致密、无裂纹，与基体形成了良好的冶金结合。
The temperature for tungsten coating on copper substrate is higher than that on molybdenum.
当其它条件都相同时，在铜基体上获得钨镀层比钼基体上所需的温度略高一些；
Results showed that adhesion between film and copper substrate could be greatly improved using such interlayers.
采用钛铝-钼过渡层，金刚石膜和铜衬底间的结合力大大提高。
At the same time the size of the copper substrate and the cooling condition of substrate's bottom are optimized.
并对铜基板尺寸、基板底面散热条件等几项关键参数进行了优化设计。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
The features and microstructure of the cladding layer and interface layer between cladding layer and copper substrate were analyzed.
对熔覆层和熔覆层与基体结合区的形貌和微观组织进行了研究。
This paper introduced a new copper treatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.
本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。
Based on developed numerical simulation method, the impacting behavior of copper particle colliding copper substrate in process of transforming material property is investigated.
采用有限元数值计算方法，研究冷喷涂材料改性过程中铜粒子与铜基体非垂直碰撞的变形行为。
Based on developed numerical simulation method, the impacting behavior of copper particle colliding copper substrate in process of transforming material property is investigated.
采用有限元数值计算方法，研究冷喷涂材料改性过程中铜粒子与铜基体非垂直碰撞的变形行为。
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