The results showed the reaction of copper deposition was irreversible.
结果表明：铜沉积反应是不可逆的。
An electroless deposition technique on carbon fiber with higher copper deposition rate and stability was presented.
提出了一种有较高沉铜速率和稳定性的碳纤维化学镀技术。
The results show that Ar-H2 plasma treatment of the Au substrate leads to a significant enhancement of the uniformity of the copper deposition layer.
结果显示利用氩氢等离子体对金基底材料表面进行处理能有效地提高铜沉积层的均一性。
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