The results showed the reaction of copper deposition was irreversible.
结果表明：铜沉积反应是不可逆的。
An electroless deposition technique on carbon fiber with higher copper deposition rate and stability was presented.
提出了一种有较高沉铜速率和稳定性的碳纤维化学镀技术。
The results show that Ar-H2 plasma treatment of the Au substrate leads to a significant enhancement of the uniformity of the copper deposition layer.
结果显示利用氩氢等离子体对金基底材料表面进行处理能有效地提高铜沉积层的均一性。
The trial was conducted to study the effects of dietary copper levels of different sources on copper deposition and histopathological changes of liver of broilers.
本研究旨在探讨日粮铜来源及水平对肉鸡肝铜沉积及其组织病理学变化的影响。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
In this work, copper underpotential deposition on gold is studied under realistic electrochemical conditions
本文研究了在实际电化学条件下铜在金表面的低电位沉积
The biggest difficulty is chemical deposition of copper of PTFE activation pretreatment, is also the most crucial step.
其最大的难点是化学沉铜前的聚四氟乙烯活化前处理，也是最为关键的一步。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
To obtain the amorphous alloy films with superior properties by electrochemical deposition, the accuracy requirement of copper substrates is extraordinarily strict.
为了获得性能优良的电化学沉积合金薄膜，需要精度非常高的合金薄膜铜衬底。
High temperature processing allows for increased deposition rates and decreased specific resistivity values for the deposited copper films.
高温处理会增加沉积速率，减少铜沉积薄层的电阻率。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The progress in the study of cyanide-free copper electroplating on steel matrix is introduced according to different valences of copper in the deposition process.
按照沉积过程中铜的价态的不同对在钢铁基体上无氰碱性镀铜的研究进展进行了说明。
Upon analysis, it was concluded that the problem was caused by the deposition and scaling of corrosion products in the hollow copper conductor.
经分析是空心铜导线有腐蚀产物沉积结垢，并对成因进行了探讨。
The results show that electroless nickel copper phosphorus alloy deposits obtained have improved corrosion resistance, appearance, adhesion, porosity, deposition rate, hardness and wear resistance.
结果表明，所得镍-铜-磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍-磷合金及前人制得的镍-铜-磷合金镀层。
With an attempt to study the effect of magnetic fluids in ferrography on the deposition of non ferromagnetic particles, the working conditions of steel copper friction pairs were monitored.
以钢-铜试件对磨后获得的油样为例进行铁谱对比实验，研究了磁流体在非铁磁性磨粒监测方面的应用。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
This study developed a view factor model to simulate the physical vapor deposition of copper interconnect in low pressure conditions using cylindrical targets.
研究开发了一个角系数模型来模拟低气压下圆柱靶溅射沉积铜连线。
This symmetric growth mode is induced by the shape changes in copper nanocrystals during catalyzing the chemical vapor deposition of acetylene.
铜纳米粒子在催化纤维的生长过程中，经历了一个重要的形状变化过程，即由初始的不规则形状变成了规则的多面体形状。
Finally, the significance of kinetic experiments in the ore deposition of sandstone-type copper deposits is also discussed.
最后探讨了动力学实验结果在砂岩铜矿成矿作用中的意义。
A new technology that the tin-nickel-copper alloy deposition can be electroplated in the citrate acid system bath was introduced.
研究了一种柠檬酸盐体系电镀锡镍铜合金新工艺。
The percentage of copper in metal deposition is determined by iodine quantity method.
采取碘量法测定沉物金属中铜的比例。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
Simulating experiments on the structural control over ore deposition provide the experimental grounds for the mechanism of formation of the Ashele copper DE...
构造控矿模拟实验为阿舍勒铜矿的形成机理，提供了实验依据。
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.
本研究报道了界面带电、浓度效应、阴离子共吸附对铜在金（ 100 ）表面的欠电位沉积层的稳定性所造成的影响。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
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