copper bath 镀铜工艺
acid electroplating copper bath 酸性镀铜溶液
copper sulfate bath 酸性镀铜液
Acid copper plating bath 酸性镀铜液
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金,用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied.
讨论了乙二醇用量、硝酸银用量、酸性镀铜液(底液)用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。
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