The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.

该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

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With the continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.

芯片规模不断增加、设计门数不断增长，验证已成为芯片开发的主要瓶颈。

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The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).

该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

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The NMC1000 is available in 40-pin, 5mm X 5mm quad flat no-lead (QFN) and 2.5mm x 2.5mm chip scale packages, requiring the industry's smallest external BOM.

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Chip-scale sensors already tell an SUV's master computer when the vehicle is about to roll over and the Wii game controller when the live player wants to swing the virtual bat.

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The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

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