The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.

该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

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I'd bet it is reaping royalties from iPhone sales too — and will until its key chip scale packaging patent expires in 2010.

我打赌它也从iPhone的销售中获得了版税—并且会一直这样，直到它的关键芯片级封装专利在2010年期满。

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With the continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.

芯片规模不断增加、设计门数不断增长，验证已成为芯片开发的主要瓶颈。

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The NMC1000 is available in 40-pin, 5mm X 5mm quad flat no-lead (QFN) and 2.5mm x 2.5mm chip scale packages, requiring the industry's smallest external BOM.

ENGADGET: Newport Media claims tiniest, lowest-power 802.11n WiFi chip yet, smartphones get a little less thirsty

Chip-scale sensors already tell an SUV's master computer when the vehicle is about to roll over and the Wii game controller when the live player wants to swing the virtual bat.

FORBES: Magazine Article

The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

FORBES: Don't Turn My Company Into A Patent Troll!