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This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
Because of the good property, PET is used widely in fibers, packaging, film and plastics, to replace the aluminum, glass, ceramic, paper, wood, steel, and other synthetic materials.
PET聚酯因其良好的性能，广泛地应用于纤维、包装、薄膜以及塑料等不同领域，以代替铝、玻璃、陶瓷、纸张、木材、钢铁和其他合成材料。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
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