This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
Because of the good property, PET is used widely in fibers, packaging, film and plastics, to replace the aluminum, glass, ceramic, paper, wood, steel, and other synthetic materials.
PET聚酯因其良好的性能，广泛地应用于纤维、包装、薄膜以及塑料等不同领域，以代替铝、玻璃、陶瓷、纸张、木材、钢铁和其他合成材料。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
Monolayer or combined packaging of ceramic thermosensitive components is selected in dependence on their application environment.
陶瓷热敏元件可视不同的使用环境选择单层或复合包封。
Ceramic shrink packaging machine, beverage packaging machine, Shenyang, Liaoning, food packaging equipment.
陶瓷收缩包装机，沈阳饮料包装机，辽宁食品包装设备。
Applicable to printing, pharmacy and floor, ceramic, drink beer, etc, the mass shrinkable packaging.
适用于印刷、制药及地板、陶瓷、饮料、啤酒等行业的大批量收缩包装。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Thus, in recent years, ceramic polycrystalline COB packaging design and system integration are gradually from all packaging lines and system vendors attention.
因此，近年来，以陶瓷材料COB设计整合多晶封装与系统线路亦逐渐受到各封装与系统厂商的重视。
Since the ancient Greeks and Romans started storing wine in ceramic vases, packaging has evolved to withstand plane crashes, outwit shoplifters, and reduce landfill trash.
自古希腊和古罗马起，人们就开始使用陶罐保存酒类，如今，酒的包装不断革新，以承担飞机坠毁的冲击，战胜商店扒手以及减少垃圾抛弃。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
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