网络释义专业释义
Temperature bonding 粘合温度
Bonding strength at room temperature 常态粘结性
Room temperature bonding 常温粘结 ; 室温键合
Normal temperature bonding 常温粘结
Low temperature bonding strength 低温粘结强度
low temperature metallic bonding 低温金属键合
双语例句原声例句
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Bonding temperature, bonding time and interlayer thickness have an obvious effect on the shear strength of the joints.
连接温度、连接时间和中间层厚度对接头抗剪强度具有较明显的影响。
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When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.
在连接温度为1403 K的条件下，随着连接时间的增加，界面反应层厚度先快速增加，再缓慢增加。
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The microhardness of the joints increases with increasing of bonding temperature, but it shows a peak value as the bonding time is prolonged.
接头显微硬度随连接温度的升高而明显提高，但随连接时间的变化存在峰值。
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That is to say brick work in high temperature furnaces, maybe tiles on the Shuttle, to resist high temperatures because of the high internal bonding.
它在能够承受高温炉的温度，例如瓷砖，能够耐受高温,因为它们有强的内部键作用。
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