Figure 7 shows the sequence for tape bonding the chip and assembling the package.

图7所示为带状引线连接芯片和管壳装配的工艺程序。

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In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.

在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。

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The RF characteristics of bonding wire interconnection in a simple package model were simulated.

针对一种用键合线连接的简单封装模型进行射频性能的模拟。

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This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.

FORBES: It's all in the packaging