A novel bonding method using silicate gel as bonding medium is developed.

报道了一种利用硅乳胶作为键合介质的新型键合技术。

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Also specifically disclosed is a bonding method using such a curable composition.

以及使用该固化性组合物的粘合方法。

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Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.

丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。

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The method used to attach the polyethylenimines to materials is also well known the bonding agent benzophenone has already been used to attach the anti-microbial agent to glass, polymer, paper, and metal.

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