分析了这些缺陷中心的本质。
通过计算电子由一种缺陷中心向另一种缺陷中心的跳跃几率,解释了非晶半导体中的低温带隙跳跃导电问题。
The hopping conduction in energy gap of amorphous semiconductors at low temperature is explained by calculating hopping probability when an electron hops from one defect center to the other.
集成的缺陷和性能管理能够使单个管理保护下的操作中心发生突变。
Integrated fault and performance management enables consolidation of operations centers under a single management umbrella.
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