无引线片式载体 LCC
料带引线片式载体 Plastic Leaded Chip Carrier ; PLCC
引线片装 PLCC
无引线片载 LCC
塑封带引线片式载体 PLCC
多引线芯片 multilead chip
无引线芯片座 leadless chip carrier ; lcc
有引线芯片座 leaded chip carrier
无引线陶瓷芯片载体 leadless ceramic chip carrier ; LCCC ; leaderless ceramic chip carrier
塑料有引线芯片载体 PLCC ; plastic leaded chip carrier
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
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