• 1. conductor layer: 导线层 | 导体层
• 2. semi-conductor layer: 半导体层
• 3. single layer photo conductor: 单层光导器件

• 1.On the palladium conductor layer is then directly formed a copper deposit by electroplating.
  然后通过电镀在钯导电体层上直接形成铜沉积物。
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• 2.In the conductor layer formation step, a single conductor layer including first and second measurement points is formed on a substrate.
  在上述导电体膜形成工序中，在基板上形成包含第一测定部和第二测定部的单一的导电体膜。
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• 3.A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).
  介层洞形成于螺旋图案化导体层内部的基材中，该介层洞通过硅通孔技术制成。
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