• 1. Flip Chip Technology: 倒装焊技术 | 倒装芯片技术
• 2. FCT-Flip Chip Technology: 技术
• 3. flip-chip technology: 倒装式芯片技术

更多释义

• 1.Flip chip technology has become one of the major joining technologies in electronic packaging.
  摘要覆晶技术已成为电子构装中之主要接合技术之一。
  dict.yoduao.com
• 2.Flip chip technology has become one of the major joining technologies in electronic packaging.
  覆晶技术已成为电子构装中之主要接合技术之一。
  dict.yoduao.com
• 3.This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
  介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
  dict.yoduao.com

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