提出并设计完成了金属铠装结构的FBG温度传感器和类陶瓷封装结构的FBG温度传感器。

We have designed and fabricated metal armoured FBG temperature sensor and ceramic FBG temperature sensor.

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双列塑封的信号处理集成电路BY 139平均失效率达到10.8%，方形陶瓷封装的逻辑控制电路PC 11平均失效率达到2.5%。

The average failure rate of signal processing molectron BY139 was 10.8%. And the average failure rate of logical controlling molectron PC11 was 2.5%.

youdao

双列塑封的信号处理集成电路BY 139平均失效率达到10.8%，方形陶瓷封装的逻辑控制电路PC 11平均失效率达到2.5%。

The average failure rate of signal processing molectron BY139 was 10.8%. And the average failure rate of logical controlling molectron PC11 was 2.5%.

youdao