讨论了锡须形成的影响因素及机理。
The affecting factors and mechanism of whisker forming were discussed.
讲述表面处理引起的问题，特别是锡须。
The problems caused by surface finishes, particularly tin whiskers, are addressed.
介绍了控制锡须的其它一些有效措施及锡须生长加速试验。
And thereby an effective method for controlling whisker forming as well as the solutions for other difficult problems in pure tin electro...
当施加恒定外应力后进行室温处理，锡须的形成完全受到抑制。
When adding stress with ambient temperature storage, the formation of tin whisker was completely inhibited.
本文详细阐述一个完备的生产过程，它能有效地控制连接器表面锡的回流变色和锡须形成的问题。
The successful use of the total process to control tin reflow discoloration and whisker behaviour on connectors in a production environment is described.
锡须，一种自发从锡和锡合金层生长出来的现象，它会导致电路短路，影响电子产品长期的可靠性。
Tin whiskers, growing spontaneously from Sn and Sn alloy coatings, can cause electrical shorts in the circuit and present a long-term reliability problem to the electronic industry.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
这将导致形成刺出锡涂层的锡晶须。
This can lead to the formation of tin whiskers erupting out of the tin coating.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
然而，人们普遍认为环保组件的市场需求将最终超过潜在的锡晶须组件失败。
However, it is generally thought that the market demand for environmentally friendly components will eventually outweigh the potential for tin whisker component failure.
如果所用的是粒状锡，那么须靠小心加温来引起反应。
If granulated tin is used the reaction may have to be initiated by careful warming.
如果所用的是粒状锡，那么须靠小心加温来引起反应。
If granulated tin is used the reaction may have to be initiated by careful warming.
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