概述了元件安装机的最新技术动向和无通风管道再流焊炉绿色技术。
This paper describes newly technology trend of component mounter and green technology of ductless reflow furnance.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
在再流焊无铅化过程中，再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
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