通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
通孔内设置有至少三个附连位点。
At least three attachment sites are positioned within the bore.
导电凸块的纵向尺寸大于通孔的纵向尺寸。
The size of the conductive bump is bigger than the longitudinal size of the through hole.
得出了通孔泡沫铝合金的压缩应力应变曲线。
The compression stress-strain curves of porous aluminum alloy are obtained.
标准表面贴装技术或通孔技术提供足够的性能。
Standard surface-mount technology or through-hole techniques provide adequate performance.
该第一导电构件的至少一部分位于第一通孔中。
At least a part of the first conductive member is located in the first through hole.
提供了通孔内设置有三个缝线附连位点的骨锚。
Bone anchors are provided having three suture attachment sites disposed within a bore.
在定位平台上设置的定位孔可以是通孔或盲孔。
The positioning holes which are arranged on the platform can be through holes or blind holes.
已经到达上端的电镀液穿过管状电极的通孔循环。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
建成的墙体包含内部支承结构和隔热芯，不含通孔。
The constructed walls comprise internal supporting structures and heat insulating cores, but not through holes.
作为改进，在所述连接板上有与所述间隙相通的通孔。
As the improvement, the connecting plate is provided with through holes communicated with the gaps.
介绍了通孔回流焊的概念、特点、分类和使用工艺要点。
The things of through-hole reflow's concept, characteristics, division and technical gist are described in this paper.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
骨锚包括锚件主体，锚件主体具有在其近端开口的通孔。
The bone anchors comprise an anchor body having a bore that opens at a proximal end of the anchor body.
此研究对高速数字设计者深入理解导通孔设计有一定意义。
The study allows high-speed digital designers to have a more indepth assessment of via design.
主轴中有一个贯穿全长的通孔，长棒料可以通过该孔送料。
A longitudinal hole extends through the spindle so that long bar stock can be fed through it.
所述板形主体形成有连接所述底表面与所述第二表面的通孔。
The plate-shaped main body is formed with a through hole connecting the bottom face and the second face.
研究了具有三维通孔网状结构不锈钢泡沫的前驱体制备工艺。
The preparation technology of precursor for stainless steel foam with 3-d network open cells structure was investigated.
所述第二端包括端壁，所述端壁中包括与所述通道连通的通孔。
The second end includes an end wall including a hole therein communicating with the passage.
在开口钻内设有一通孔，通孔内设有与其相配合的定位克氏针。
The utility model is characterized in that an open drill is provided with a through hole in which an engaged positioning Kirschner pin is arranged.
分析了无通孔接地板对共面波导(CPW)至微带转换过渡的影响。
The transition effect of the via-free transition from coplanar waveguide (CPW) to microstrip is analyzed.
本发明涉及一种具导通孔的电子元件及薄膜晶体管元件的制造方法。
The invention relates to an electronic element with a through hole and a manufacturing method for a film transistor element.
它由气动活塞式执行机构和O型球阀组成，阀芯采用圆柱形通孔球体。
It consists of pneumatic piston actuator and the composition of O-type ball valve, valve core sphere using cylindrical hole.
贯穿层间绝缘膜形成通孔，并且该通孔到达比上电极上表面深的位置。
A via hole is formed through the interlayer insulating film and reaches a position deeper than an upper surface of the upper electrode.
是否通过切片检验pth与小导通孔孔壁状况，并有相应的改善对策跟踪？
Is PTH and small via hole wall quality checked by cross-section and followed by a closed loop corrective action?
四通孔布线算法用于实际MCM布线时，需要解决最大加权不相交匹配问题。
For the Four Via routing algorithm used in MCM routing, the maximum weighted non crossing match problem should be solved.
通孔拐角附近是应力应变的集中区，沿界面至焊盘外缘，应力应变逐渐降低。
The stress-strain concentration is detected at the corner of Cu pad, the lower stress for the outer of Cu pad.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
本实用新型主要由设有扁平的板体部分的杆体组成，所述板体部分开有通孔。
The utility model is mainly composed of a bar body which is provided with a flat plate body part, wherein the plate body part is provided with through holes.
介层洞形成于螺旋图案化导体层内部的基材中，该介层洞通过硅通孔技术制成。
A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).
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