运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。
An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
新工艺有效地解决了连接器表面纯锡的回流变色问题，实现了工业化生产。
The problem of pure tin deposit reflow discoloration on connector was solved effectively with the new technics, which has been put into industrial production.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
采用高纯锡，通过自行设计的直流电弧等离子体蒸发设备制备了纯净的纳米锡粉。
The nanometer tin powders were prepared by DC arc plasma evaporation method using a self-designed and fabricated apparatus.
结果显示在纯锡中添加1%（质量分数，下同）P，能够提高强度、刚度，降低塑性；
The results show that doping 1%( mass fraction, same as below) P to pure tin can improve the strength and stiffness, decrease the plasticity.
在生产过程中，为追求品质的稳定，所有纯锡、纯铅材料均由原产地云南、广西直接购进。
In the production process, the pursuit of quality and stability, all pure tin, lead materials are pure origin Yunnan, Guangxi direct purchase.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
繁荣的市场使得中国成为了锡的纯进口国。
China's booming market has also turned the country into a net importer of the metal.
本发明还可以清除锡炉内多余释出在锡面的金属及氧化杂质，起到提 纯作用；
The reducer also can help remove excess metals and oxidation impurities released on tin surface from a tin furnace to play the role of purification;
本发明还可以清除锡炉内多余释出在锡面的金属及氧化杂质，起到提 纯作用；
The reducer also can help remove excess metals and oxidation impurities released on tin surface from a tin furnace to play the role of purification;
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