锡是排列在白金、黄金、白银之后的第四种稀有金属，对人体无害，被称为绿色金属。
向焊料槽中添加纯锡可以对合金进行控制。
运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。
An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
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