一般说来，剪切键承载能力主要受预埋件控制，但在制定现行规范时对多排多列角钢预埋件的试验研究较少。
Generally speaking the loading capacity of shear key is mainly governed by embedded part, while quite few test have been taken to the embedded part when the on -going specification is established.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
较高极性的脲键给聚合物提供了较强的氢键和较好的热稳定性，并使这些聚合物在橡胶平台区有较高和变化较小的动态剪切模量。
The highly polar urea linkage offers stronger hydrogen bonding and higher thermal stability to the polymers, which introduces higher and flatter shear modulus the rubbery plateau.
粘接的结果增强了交联键强度，而降低了在压力、拉力和剪切力作用下，比较容易分离的现象。
This results in a much stronger bond that lasts longer and is much less susceptible to separation under compressive, tensile and shear forces.
这类土，由于固化联结键和高孔隙度，其压密特性，孔隙压力的变化和剪切应力—应变关系均与应力水平有密切关系。
Owing to the bonds and high porosity in such soils, its characteries of compressibility, the change of pore-pressure and shear stress-strain relationship all depend on stress level.
这类土，由于固化联结键和高孔隙度，其压密特性，孔隙压力的变化和剪切应力—应变关系均与应力水平有密切关系。
Owing to the bonds and high porosity in such soils, its characteries of compressibility, the change of pore-pressure and shear stress-strain relationship all depend on stress level.
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