这类土，由于固化联结键和高孔隙度，其压密特性，孔隙压力的变化和剪切应力—应变关系均与应力水平有密切关系。
Owing to the bonds and high porosity in such soils, its characteries of compressibility, the change of pore-pressure and shear stress-strain relationship all depend on stress level.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
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