The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
其方法是往硅片上涂上一层二氧化硅防护膜。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Anisotropically conductive connector, probe material member, wafer inspection apparatus, and wafer inspection method.
各向异性导电连接器，探针元件，和晶片检测仪器及晶片检测方法。
Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method.
各向异性导电连接器，导电浆料成分，探针元件，和晶片检测仪器及晶片检测方法。
The invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.
本发明公开了一种具有穿导孔的硅晶片及其制造方法。
The method avoids the problem that the wafer break is caused by thermal stress in the course of cooling down, especially is suitable for preparing gallium nitride and aluminum nitride substrates.
该方法避免了降温过程中热应力造成的晶片破裂问题，尤其适于氮化镓、氮化铝衬底的制备。
In the wafer notch detecting part, edge flexion method is adopted to find the notch range, then calculating the notch center by means of arc fitting.
缺口检测先采用边缘变化率算法查找缺口范围，再通过圆弧拟合的方法求出缺口中心位置。
A novel in-situ non-flatness measurement method of wafer stage mirrors in a step-and scan lithographic tool is presented.
提出一种新的步进扫描投影光刻机工件台方镜不平度测量方法。
A structure and method for fabricating imagers that detect light from the backside of the wafer.
本发明揭示一种用于制作从晶片的背侧检测光的成像器的结构及方法。
The calculative method of the large field projection lithography lens is presented, and on the distortion measuring setup which is accomplished, distortion measurement of 8 inch wafer is completed.
提出了针对大视场投影光刻物镜畸变的计算方法，并在完成的畸变特性测量装置上进行了8英寸的硅片测量。
The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate.
一种用于形成用于将焊料转移到晶片的焊料模的方法包括将多个焊料腔蚀刻到基板中。
The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本发明的切片方法，可以实现更高的光伏晶片的面积利用效率。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
Using conventional method of making visible light emitting porous silicon, an emitting sample with even visible light, detected by naked eyes. is prepared on unpolished polycrystal silicon wafer.
用制备发光多孔硅样品的常规电化学方法，在未抛光多晶硅表面，成功地制备出了均匀地发射肉眼可分辨的可见光样品。
By adopting the method of the embodiment of the invention, the stability and the production efficiency of the produced semiconductor wafer can be improved.
采用本发明实施例的方法能够提高生产的半导体晶圆的稳定性和生产的效率。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同，对控制形貌起伏的硅片表面当作首选方法。
To make the criteria and method with no loss and fasting resolution for received wafer and mixed-up wafer, apply to produce.
对回收片、混淆片制定了可操作的无损快速分辨目前常用的压电基片的手段和规范，应用于生产。
A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate;
一种制造喷墨打印头的方法，包括：准备具有（110）晶面取向的单晶硅晶片作为基板；
Using the photovoltaic spectral response of epitaxial P-N junction, the paper suggests a method of determining the minority carrier diffusion length in N layer of N/P epitaxial silicon wafer.
本文提出了用N/P硅外延片的结光电压光谱响应确定N/P硅外延片中少子扩散长度的方法。
At present, the proposed method has been applied to the actual wafer fab with better performance.
目前，该方法已在某实际半导体生产线中应用并取得了良好的效果。
Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer.
Jiro Kajiwara：晶片传送装置和晶片研磨装置，以及晶片的制造方法。
Finally, this paper primarily establishes a testing method of characterization silicon carbide wafer quality.
最后，初步确立了表征碳化硅单晶抛光片质量的测试方法。
Provided is a method for manufacturing a semiconductor light emitting element, by which a sapphire wafer can be divided into chips accurately at an extremely high yield.
本发明提供一种半导体发光元件的制造方法，使蓝宝石晶片形成芯片时，能够以极高的成品率正确地形成芯片。
The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof.
本发明提供了一种硅片交接装置及其硅片交接方法。
The impurity of iron is one major heavy-metal contamination on the silicon wafer. Surface photo-voltage method(SPV) can be used to accurately measure the iron contamination within the silicon wafer.
铁杂质是硅片制造过程中常见的重金属沾污，表面光电压（SPV）法可很好地用于测定P型硅中铁杂质。
In this paper, the area contact model of depletion layer width under avalanche breakdown in Si epitaxial wafer by a three-probe method is analysed. The theory accords with experimental results.
本文分析了三探针测试硅外延片中雪崩击穿时耗尽层宽度的面接触模型，理论和实验结果吻合。
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