The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
其方法是往硅片上涂上一层二氧化硅防护膜。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
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