Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.
多孔硅作为一种牺牲层材料，在表面硅微机械加工技术中有着重要的应用。
Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.
表面微机械加工使用选择的材料和干法和湿法蚀刻工艺以形成电路层。
Using surface micromachining techniques allows applications of up to nearly 100 finely applied layers of circuit patterns on one chip.
采用表面微机械加工技术允许多达近100精细的应用在一个芯片上的电路图案层的应用。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
Based on the detailed analysis of MEMS surface micromachining process, the data model of surface micromachining process was built by the process oriented method.
首先对MEMS表面加工工艺进行了详细的分析，采用面向过程的方法建立了表面工艺过程的统一模型。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
The surface micromachining process uses either crystal silicon chip substrates as a foundation upon which to build layers, or can be started on cheaper glass or plastic substrates.
表面微加工工艺采用两种晶体硅芯片基板作为赖以建立层的基础，或者可以在更便宜的玻璃或塑料基板启动。
In the area of manufacturing, lasers are used for drilling, cutting, joining, hardening, surface modification and micromachining.
在生产领域，激光可以用来钻孔、切割、连接、硬化以及进行表面改性和微加工。
Instead of surface sacrificial layer and bulk micromachining technique, using polymer as thermal isolation material decreases cost and improves yield.
以聚合物材料作为绝热材料，避免了表面牺牲层工艺和体加工技术，降低了成本、提高了成品率。
Instead of surface sacrificial layer and bulk micromachining technique, using polymer as thermal isolation material decreases cost and improves yield.
以聚合物材料作为绝热材料，避免了表面牺牲层工艺和体加工技术，降低了成本、提高了成品率。
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