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surface micromachining

  • 表面微加工

专业释义英英释义

  • 表面微加工 - 引用次数:3

    参考来源 - 静电排斥驱动六边形MEMS微镜 Hexagon MEMS Micromirror Actuated by Electrostatic Repulsive Force

·2,447,543篇论文数据,部分数据来源于NoteExpress

Surface micromachining

  • abstract: Unlike Bulk micromachining, where a silicon substrate (wafer) is selectively etched to produce structures, surface micromachining builds microstructures by deposition and etching of different structural layers on top of the substrate. Generally polysilicon is commonly used as one of the layers and silicon dioxide is used as a sacrificial layer which is removed or etched out to create the necessary void in the thickness direction.

以上来源于: WordNet

双语例句

  • Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology.

    多孔作为一种牺牲材料,表面机械加工技术有着重要应用

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  • Surface micromachining USES select materials and both wet and dry etching processes to form the circuitry layers.

    表面微机械加工使用选择材料干法湿蚀刻工艺形成电路

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  • Using surface micromachining techniques allows applications of up to nearly 100 finely applied layers of circuit patterns on one chip.

    采用表面机械加工技术允许多达100精细应用一个芯片上电路图案的应用。

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