The results showed that reducing thiols concentration can reduce specific surface energy, so as to enhance transfer efficiency and spreading effect of ink on substrate surface.
结果表明：降低硫醇浓度可降低其比表面能，从而增大转移率和增强在基底表面的铺展效果。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
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