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The results showed that reducing thiols concentration can reduce specific surface energy, so as to enhance transfer efficiency and spreading effect of ink on substrate surface.
结果表明:降低硫醇浓度可降低其比表面能,从而增大转移率和增强在基底表面的铺展效果。
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.
硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。
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