A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed.
采用瞬间液相烧结工艺来形成焊接材料，其中首先形成前体材料。
Factors that affect the surface resistance of the board include the board material, the presence of coatings such as solder masking or conformal coatings, and board cleanliness.
影响印制板表面电阻的因素包括印制板材料、有无涂层(例如防焊漆或保形涂层)，以及电路板的清洁。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
Solder factory is mainly engaged in the production and marketing of products, aluminum copper alloy brazing flame or high-frequency brazing material.
本厂主要从事焊锡制品的生产和销售，铝铜合金的火焰钎焊或者高频钎焊材料。
The material used for solder pot, particularly for the part with a tight contact with flow solder, should avoid direct use of stainless steel.
锡炉材料特别是与流动钎料接触比较紧密的部分应尽量避免直接使用不锈钢材料。
Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。
Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
The cured material provides excellent protection for solder joints against mechanical and thermal stress such as shock, drop, and vibration in hand-held devices.
该材料在固化后可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling.
本发明钎料的制备方法如下：将活性钎料原材料加入到行星式球磨机中进行球磨。
The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling.
本发明钎料的制备方法如下：将活性钎料原材料加入到行星式球磨机中进行球磨。
应用推荐