A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed.
采用瞬间液相烧结工艺来形成焊接材料，其中首先形成前体材料。
Factors that affect the surface resistance of the board include the board material, the presence of coatings such as solder masking or conformal coatings, and board cleanliness.
影响印制板表面电阻的因素包括印制板材料、有无涂层(例如防焊漆或保形涂层)，以及电路板的清洁。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
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