This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
This article mainly introduces the excellent features of low melting Point solder which is used for aluminium soldering. This solder is the new Product researched and developed recently.
本文主要介绍新研制成功的铝钎焊用低熔点焊料的优良性能。
This article mainly introduces the excellent features of low melting Point solder which is used for aluminium soldering. This solder is the new Product researched and developed recently.
本文主要介绍新研制成功的铝钎焊用低熔点焊料的优良性能。
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